JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Tag:

#Best thermal paste

NANO DIAMOND THERMAL GREASE DX2

Best thermal paste , GPU cooler , Thermal paste application
  • Thermal Resistance (℃·cm²/W)
    0.048
  • hermal Conductivity (W/m·K)
    17 MAX
  • Specific Gravity (g/cm³)
    2.9
  • Viscosity (mPa·s)
    5,000.000
  • Color Appearance
    Gray

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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