JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Tag:

#Thermal paste for laptops

  • Thermal Resistance (℃·cm²/W)
    0.08
  • hermal Conductivity (W/m·K)
    8.9
  • Specific Gravity (g/cm³)
    2.7
  • Viscosity (mPa·s)
    5,500,000
  • Color Appearance
    Gray
  • Thermal Resistance (℃·cm²/W)
    0.147
  • hermal Conductivity (W/m·K)
    4
  • Specific Gravity (g/cm³)
    1.9
  • Viscosity (mPa·s)
    700,000
  • Color Appearance
    Gray
  • Thermal Resistance (℃·cm²/W)
    0.008
  • hermal Conductivity (W/m·K)
    18.3
  • Specific Gravity (g/cm³)
    2.58
  • Viscosity (mPa·s)
    3,900,000
  • Color Appearance
    Gray
  • Thermal Resistance (℃·cm²/W)
    0.05 @ 60 Psi
  • hermal Conductivity (W/m·K)
    16 MAX
  • Specific Gravity (g/cm³)
    2.7
  • Viscosity (mPa·s)
    3,000,000
  • Color Appearance
    Gray

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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