JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter of Thermal Compound, Thermal Compounds, Thermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us.
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.
JP-Diamond-series is made of NANO diamond-like particles of hybrid compound, design for using in environment with low thermal resistance. JP-Diamond-series Nano diamond-like particles helps dissipate and transfer the heat when compressed.
JP-Diamond-series can be easily applied and removed. Just one pea-sized amount of the JP-Diamond-series will do. Once the CPU cooler is installed the JP-Diamond-series particles will spread and maximize the contact area.
JP-Diamond-series has no burn-in time that is required to reach maximum performance. Formulated to maximize efficiency instantly when applied.
The JP-Diamond-series contains a silicon-free compound that provides excellent long-term stability. The silicon-free compound has an effective thermal cycling, and low dry-out features.
JP-Diamond-series can be applied to any type of Cooler to enhance the thermal conductivity. JP-Diamond-series does not contain any metal or other electrically conductive materials that will harm other components.
JP-Diamond-series has a maximum capability of an operating temperature of -100°C to 350°C. JP-Diamond-series will provide a stable working status at any extreme temperature and conditions.
The JP-Diamond-series is a superb quality thermal compound for heatsinks. JP-Diamond-series improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. The JP-Diamond-series is a high-purity Nano diamond-like particle paste that helps to ensure maximum heat dissipation for optimized performance and greater system stability.
Well known for its outstanding quality, our high-performance DX thermal compound is a regular winner in performance tests. It offers a very low thermal resistance due to its minimum bond line thickness and is easy to apply, even for beginners.
The surfaces of processor chips and cooler floors are covered with microscopic dents. This leads to extremely high thermal conductivity, guaranteeing that heat is dissipated quickly and efficiently from the CPU or GPU. With its outstanding performance, the DX1 is not only an excellent choice for overclockers and enthusiasts, but also for other sapplications that require thermal transmission