JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
THERMAL INTERFACE MATERIAL EXPORTER, FACTORY IN TAIWAN
JP-Dx2 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity.
THERMAL INTERFACE MATERIAL EXPORTER, FACTORY IN TAIWAN
Keep your CPU cool and running efficiently with JunPus JP-CL1 TIM Cleaning Wipes, the ideal solution for removing thermal paste, dirt, and residues from your computer components. Designed for professional-grade cleaning, these wipes help improve your system’s thermal performance and extend its longevity.
Excellence in Heat Dissipation Engineering
JunPus International Co., Ltd. is a global leader in heat dissipation solutions, specializing in high-performance thermal materials such as thermal paste, thermal pads, and thermal interface materials for AI chips, CPUs, GPUs, and 5G base stations. Our patented technologies optimize thermal performance, ensuring stability for semiconductors, neural network accelerators, and edge computing devices under high workloads. Trusted by industries in electronics, telecommunications, and automotive sectors, JunPus drives innovation in thermal management for AI systems, data centers, and smart devices, delivering outstanding solutions based on heat dissipation expertise.
Premium Thermal Paste for Electronics and Semiconductors
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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