JunPus-Thermal compound products from Taiwan!
JunPus International Co., Ltd., A Leader In Thermal Management Solutions, Specializes In Manufacturing, Supplying, And Exporting Superior Thermal Compound Pastes From Our Advanced Facility In Taiwan. Our Commitment To Excellence Is Demonstrated Through Our Adherence To Rigorous Manufacturing Processes, Ethical Business Practices, And Continuous Employee Involvement, Earning Us Several Patents And International Standards Compliance. Our Products, Made From The Finest Raw Materials, Are Renowned For Their Durability, Efficiency, And Ability To Enhance The Performance Of Electronics And Computer Components. Specifically Designed To Facilitate Heat Transfer From Semiconductor Components To Heat Sinks, Our Thermal Compounds Are Essential For Optimizing Thermal Dissipation In The Electronics And Computer Industries. JunPus Is Dedicated To Delivering High-Quality Products That Exceed Our Customers' Expectations In Performance And Longevity. For Top-Tier Thermal Management Solutions, Contact JunPus International Co., Ltd.
JP-Diamond-series is made of NANO diamond-like particles of hybrid compound, design for using in environment with low thermal resistance. JP-Diamond-series Nano diamond-like particles helps dissipate and transfer the heat when compressed.
JP-Diamond-series can be easily applied and removed. Just one pea-sized amount of the JP-Diamond-series will do. Once the CPU cooler is installed the JP-Diamond-series particles will spread and maximize the contact area.
JP-Diamond-series has no burn-in time that is required to reach maximum performance. Formulated to maximize efficiency instantly when applied.
The JP-Diamond-series contains a silicon-free compound that provides excellent long-term stability. The silicon-free compound has an effective thermal cycling, and low dry-out features.
JP-Diamond-series can be applied to any type of Cooler to enhance the thermal conductivity. JP-Diamond-series does not contain any metal or other electrically conductive materials that will harm other components.
JP-Diamond-series has a maximum capability of an operating temperature of -100°C to 350°C. JP-Diamond-series will provide a stable working status at any extreme temperature and conditions.
Engineered with precision, the JP-Diamond-series thermal compound is the result of extensive research and development, culminating in a proprietary blend that incorporates high-purity, nano diamond-like particles. This distinctive formulation is unparalleled, setting the JP-Diamond-series apart as the only brand worldwide to offer such advanced thermal management capabilities.
Unmatched Thermal Conductivity with Exclusive Nano Diamond Technology
The cornerstone of the JP-Diamond-series' unmatched performance is its unique nano diamond technology. These nano diamond-like particles are not merely additives; they are the core of a revolutionary approach to thermal conductivity. This exclusive technology ensures optimal heat transfer from the CPU to the heatsink, significantly enhancing cooling efficiency and system performance.
Well known for its outstanding quality, our high-performance DX thermal compound is a regular winner in performance tests. It offers a very low thermal resistance due to its minimum bond line thickness and is easy to apply, even for beginners.
The surfaces of processor chips and cooler floors are covered with microscopic dents. This leads to extremely high thermal conductivity, guaranteeing that heat is dissipated quickly and efficiently from the CPU or GPU. With its outstanding performance, the DX1 is not only an excellent choice for overclockers and enthusiasts, but also for other sapplications that require thermal transmission