JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
THERMAL INTERFACE MATERIAL EXPORTER, FACTORY IN TAIWAN
JP-Dx2 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity.
THERMAL INTERFACE MATERIAL EXPORTER, FACTORY IN TAIWAN
Keep your CPU cool and running efficiently with JunPus JP-CL1 TIM Cleaning Wipes, the ideal solution for removing thermal paste, dirt, and residues from your computer components. Designed for professional-grade cleaning, these wipes help improve your system’s thermal performance and extend its longevity.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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