JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
• Exceptional Thermal Performance:
Thermal conductivity of 4 W/m·K, ensuring efficient heat transfer for AI processors and high-power chips.
• Advanced Composition:
Features nanodiamond powder and silicone for maximum thermal efficiency.
• AI-Optimized Design:
Specially engineered to handle the high thermal output of AI accelerators, neural network processors, and edge computing devices.
• Chemical Stability:
High resistance to oxidation, non-corrosive, non-volatile, and non-flammable.
• Safe and Eco-Friendly:
Non-toxic, skin-friendly, and compliant with RoHS Directive (SGS No. CE/2008/12124).
• Long-Term Reliability:
Retains stability over time and supports long-term storage.
• Process Compatibility:
Easy to integrate into precision printing and coating processes.
JP-DL700 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity. Formulated with nanodiamond powder and silicone fluids, JP-DL700 delivers exceptional heat dissipation for applications requiring advanced thermal management.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
Do you need assistance?
For any questions or concerns, you can reach us via our contact form
