JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Key Features

 

1. High Thermal Conductivity

• Enhances heat transfer efficiency, reducing the risk of overheating.

• Available with tailored thermal conductivity levels to suit specific needs.

2. Strong and Durable Adhesion

• Provides a secure bond between components and heat sinks, ensuring long-term stability.

3. Flexible and Versatile

• Easily conforms to irregular surfaces, making it ideal for complex designs.

• Works with various materials like metal, plastic, and ceramic.

4. Temperature Resistance

• Operates effectively in a temperature range from -40℃ to 150℃, suitable for demanding environments.

5. Eco-Friendly and Safe

• Manufactured with RoHS-compliant, flame-retardant materials for safety and environmental friendliness.

6. Thin and Lightweight

• Minimal impact on product design and weight, ideal for compact devices.


Applications

 

Consumer Electronics: Smartphones, tablets, and LED lighting.

Automotive Systems: Battery modules, inverters, and power systems in electric vehicles.

Industrial Equipment: Cooling solutions for power supplies, motors, and heavy machinery.

Telecommunication Devices: Thermal management in 5G base stations and networking hardware.


Why Choose JunPus Thermal Conductive Adhesive Tape?

JunPus Thermal Conductive Adhesive Tape combines exceptional heat dissipation and reliable bonding in a single, easy-to-use product. Its versatility and durability make it an excellent choice for industries requiring top-notch thermal management.

High-Performance Thermal Tape

JunPus Thermal Conductive Adhesive Tape is a high-performance solution designed for effective heat transfer and secure bonding in electronic devices. Combining excellent thermal conductivity with strong adhesion, it ensures reliable performance in heat dissipation applications across various industries.

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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