Taipei , Taiwan – January 8, 2025 —— As CES 2025 sets the stage for global tech innovations, JunPus reinforces its leadership in thermal management solutions with its flagship product, JP-DXSquare Elite Thermal Paste. Designed to address the increasing heat dissipation demands of AI processors, EV battery systems, high-performance GPUs, and servers, this advanced thermal paste is poised to be a game-changer for industries that require efficient and long-term thermal stability.

[Japan, 2024] – Ainex, a leading brand in PC hardware solutions, in collaboration with JunPus International, proudly announces the official launch of JP-DX Elite Thermal Paste in 2024. This groundbreaking product sets a new benchmark in thermal management, delivering cutting-edge cooling performance for high-performance computing and next-generation AI systems.

Enhancing Thermal Management for High-Powered Devices

With the rapid evolution of technology, the demand for efficient thermal management in high-performance electronic devices is at an all-time high. In response, JunPus International proudly introduces the JP-DX2 Nano-Diamond Thermal Compound—a cutting-edge thermal interface material (TIM) designed to meet the challenges of modern electronics.