JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JunPus International Co., Ltd. Launches JP-Dx1 for Superior Heat Dissipation
Taipei, Taiwan – JunPus International Co., Ltd., a global leader in thermal management solutions, proudly announces the release of JP-Dx1, a cutting-edge thermal compound engineered with advanced nano diamond technology. JP-Dx1 sets a new benchmark in heat dissipation, catering to the growing demands of high-performance CPUs, GPUs, and AI-driven processors.
As computational power increases in modern electronics, the need for reliable and efficient thermal solutions has never been more critical. JP-Dx1 addresses these challenges with its revolutionary composition, ensuring maximum thermal conductivity, stability, and eco-friendliness.
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