JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Revolutionizing Thermal Management: Introducing JP-DXSquare Elite Nano Diamond Thermal Paste

[ Taiwan, 2024]JunPus International, a global leader in thermal management solutions, proudly announces the launch of JP-DXSquare Elite Nano Diamond Thermal Paste, a breakthrough in thermal interface material technology designed to meet the demands of high-performance computing, AI applications, and industrial cooling solutions.

A New Benchmark in Thermal Management

 

JP-DXSquare Elite introduces cutting-edge Square Nano Diamond Particle Technology, setting a new standard for thermal conductivity and heat dissipation. This innovative thermal paste is designed for applications requiring maximum efficiency and stability, ensuring optimal performance under extreme operating conditions.

 

Key Features of JP-DXSquare Elite

 

1. Exceptional Thermal Conductivity

With an industry-leading 18.3 W/m·K, JP-DXSquare Elite delivers unmatched heat transfer efficiency, critical for cooling high-performance CPUs, GPUs, and industrial components.

2. Ultra-Low Thermal Resistance

Featuring a thermal resistance of just 0.008 ℃·cm²/W, JP-DXSquare Elite ensures minimal heat flow restriction, enhancing overall system reliability and longevity.

3. Square Nano Diamond Particle Technology

The unique square particle geometry optimizes contact area, improving gap filling by 25% compared to conventional materials. This enhances thermal performance and ensures consistent heat dissipation across the interface.

4. Environmentally Friendly and Durable

Low Volatile Content: Only 0.07%, ensuring long-term reliability.

Low Outgassing: Minimal release of gases at high temperatures, ideal for sensitive environments like data centers and industrial cooling systems.

5. Wide Temperature Stability

Designed to perform across -50℃ to 200℃, JP-DXSquare Elite is built for extreme environments, from cryogenic applications to high-power thermal loads.

6. Ease of Application

Its carefully engineered viscosity ensures smooth application, while its non-corrosive formula protects components, making it ideal for professional and consumer use.


Applications and Industry Impact

 

Artificial Intelligence and Supercomputing

Designed to meet the growing thermal demands of AI processors, GPUs, and TPUs, JP-DXSquare Elite ensures reliable performance during data-intensive operations, from model training to inference.

Industrial Cooling Systems

Perfect for high-power industrial machinery requiring efficient and reliable thermal management in extreme environments.

High-Performance Gaming and Workstations

Enhances the cooling performance of overclocked CPUs and GPUs, providing gamers and creators with stable and efficient thermal solutions.


General Manager Statement

We are thrilled to introduce JP-DXSquare Elite, which embodies our commitment to innovation and excellence in thermal management,” said Eric Lee, General Manager of JunPus International. “This product reflects our vision of providing world-class solutions to meet the evolving needs of modern industries, from AI-driven workloads to industrial applications


Availability

 

JP-DXSquare Elite Nano Diamond Thermal Paste is now available worldwide. For product specifications, technical details, and purchasing inquiries, please visit www.junpus.com or contact our sales team.


About JunPus International

 

JunPus International is a global leader in thermal management technologies, committed to delivering innovative and sustainable solutions. With a focus on cutting-edge materials and environmental responsibility, JunPus continues to set industry standards for performance and reliability.


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Website: www.junpus.com

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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