JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
Key Features
1. Efficient Thermal Paste Removal
• Specially formulated to clean thermal paste and other residues that can affect your CPU’s cooling performance.
• Ensures a clean surface for reapplying thermal compounds.
2. Improves Heat Dissipation
• Enhances the thermal conductivity between your CPU, GPU, and heatsink by removing dirt and grime.
• Prevents thermal impedance for better cooling efficiency.
3. Convenient and Easy to Use
• Pre-moistened wipes provide a quick and hassle-free cleaning experience.
• Perfect for both professionals and DIY enthusiasts.
4. Safe and Eco-Friendly
• Non-toxic formula is safe for you and your components.
• Environmentally friendly with minimal volatile content.
Applications
• Thermal Paste Cleaning:
Ideal for cleaning thermal interface materials on CPUs, GPUs, and heatsinks.
• Maintenance for Longevity:
Keeps your components clean, ensuring optimal performance and extended lifespan.
• Reapplication of Thermal Compounds:
Prepares surfaces for precise and effective reapplication of thermal paste.
Keep your CPU cool and running efficiently with JunPus JP-CL1 TIM Cleaning Wipes, the ideal solution for removing thermal paste, dirt, and residues from your computer components. Designed for professional-grade cleaning, these wipes help improve your system’s thermal performance and extend its longevity.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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