JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
Revolutionizing Thermal Management for Next-Generation Electronics
As generative AI continues to rise, the immense computational power required has led GPU manufacturers to develop even more powerful processors. However, with increasing computational performance comes greater power consumption and heat generation, creating significant challenges for thermal management. Current technologies often fall short of addressing the cooling needs of high-performance GPUs.
DXSquare Elite Nano Diamond Thermal Paste, powered by JunPus’ next-generation breakthrough technology, provides a cutting-edge solution to these challenges. With its innovative use of square nano diamond particles, this product offers unparalleled cooling efficiency, ensuring optimal performance for GPUs, CPUs, servers, and more.
Key Features
1. Revolutionary High Thermal Conductivity
• Utilizes square nano diamond particles, providing larger contact areas compared to spherical particles for superior thermal transfer.
• Delivers exceptional cooling for high-performance components.
2. Extremely Low Thermal Impedance
• Minimizes resistance to heat flow with a tightly packed particle structure.
• Significantly improves heat dissipation efficiency.
3. Stable Performance
• Maintains consistent thermal conductivity across a wide range of temperatures, even in harsh working environments.
4. Enhanced Wettability
• Spreads evenly on metal surfaces, creating a uniform thermal interface for improved cooling performance.
5. Eco-Friendly Formula
• Non-toxic, environmentally safe, and low in volatile content, ensuring reliability and user safety.
Applications
DXSquare Elite Nano Diamond Thermal Paste is ideal for:
• High-Performance CPUs and GPUs: Perfect for gaming rigs and workstations.
• Server and Data Center Cooling: Enables efficient thermal management in high-performance computing clusters.
• Electronic Components: Suitable for devices requiring enhanced heat dissipation for reliability and longevity.
DXSquare Elite Nano Diamond Thermal Paste is designed to meet the advanced thermal management
needs of high-performance electronic devices. By leveraging JunPus next-generation breakthrough
technology with square nano diamond particles, this thermal paste provides exceptional cooling solutions,
significantly reducing the operating temperatures of electronic components. Compared to traditional
spherical nano diamond particles, square nano diamond particles offer superior thermal conductivity and
heat dissipation due to their larger contact area and better packing efficiency, improving gap filling
efficiency by approximately 25%.
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