JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Revolutionizing Thermal Management for Next-Generation Electronics

 

As generative AI continues to rise, the immense computational power required has led GPU manufacturers to develop even more powerful processors. However, with increasing computational performance comes greater power consumption and heat generation, creating significant challenges for thermal management. Current technologies often fall short of addressing the cooling needs of high-performance GPUs.

 

DXSquare Elite Nano Diamond Thermal Paste, powered by JunPus’ next-generation breakthrough technology, provides a cutting-edge solution to these challenges. With its innovative use of square nano diamond particles, this product offers unparalleled cooling efficiency, ensuring optimal performance for GPUs, CPUs, servers, and more.


Key Features

 

1. Revolutionary High Thermal Conductivity

• Utilizes square nano diamond particles, providing larger contact areas compared to spherical particles for superior thermal transfer.

• Delivers exceptional cooling for high-performance components.

2. Extremely Low Thermal Impedance

• Minimizes resistance to heat flow with a tightly packed particle structure.

• Significantly improves heat dissipation efficiency.

3. Stable Performance

• Maintains consistent thermal conductivity across a wide range of temperatures, even in harsh working environments.

4. Enhanced Wettability

• Spreads evenly on metal surfaces, creating a uniform thermal interface for improved cooling performance.

5. Eco-Friendly Formula

• Non-toxic, environmentally safe, and low in volatile content, ensuring reliability and user safety.


Applications

 

DXSquare Elite Nano Diamond Thermal Paste is ideal for:

High-Performance CPUs and GPUs: Perfect for gaming rigs and workstations.

Server and Data Center Cooling: Enables efficient thermal management in high-performance computing clusters.

Electronic Components: Suitable for devices requiring enhanced heat dissipation for reliability and longevity.

NANO DIAMOND THERMAL GREASE DXSquare Elite

  • Thermal Resistance (℃·cm²/W)
    0.008
  • hermal Conductivity (W/m·K)
    18.3
  • Specific Gravity (g/cm³)
    2.58
  • Viscosity (mPa·s)
    3,900,000
  • Color Appearance
    Gray
  • Model number
    JP-DXSquare Elite , JP-DX Elite (Japan only)

DXSquare Elite Nano Diamond Thermal Paste is designed to meet the advanced thermal management

needs of high-performance electronic devices. By leveraging JunPus next-generation breakthrough

technology with square nano diamond particles, this thermal paste provides exceptional cooling solutions,

significantly reducing the operating temperatures of electronic components. Compared to traditional

spherical nano diamond particles, square nano diamond particles offer superior thermal conductivity and

heat dissipation due to their larger contact area and better packing efficiency, improving gap filling

efficiency by approximately 25%.

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

Our Company
Customer Services
Contact Info

Do you need assistance?

For any questions or concerns, you can reach us via our contact form

Login

Your Cart

The cart is empty