JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

3g
3g3g
product category, Nano-Diamond Thermal paste

NANO DIAMOND THERMAL GREASE DX1

JP-Dx1: Advanced thermal compound with nanodiamond technology, engineered for AI chips, semiconductors, and high-performance electronics.
Product Capacity
$15.00 each

  • JP-Dx1 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity. Formulated with nanodiamond powder and silicone fluids, JP-Dx1 delivers exceptional heat dissipation for applications requiring advanced thermal management.

     

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

Our Company
Customer Services
Contact Info

Do you need assistance?

For any questions or concerns, you can reach us via our contact form

Login

Your Cart

The cart is empty