JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

jp-dl700
jp-dl700NANO DIAMOND THERMAL GREASE DL700
Nano-Diamond Thermal Pad, product category

NANO DIAMOND THERMAL GREASE DL700

Our high-performance cooling solutions and thermal compounds deliver superior heat dissipation for LED systems, enhancing efficiency and lifespan.
Product Capacity
$200.00 each
  • JP-DL700 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity. Formulated with nanodiamond powder and silicone fluids, JP-DL700 delivers exceptional heat dissipation for applications requiring advanced thermal management.

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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