JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

Nano-Diamond Thermal Pad, product category

TIM CLEANING WIPES JP-CL1

Keep your semiconductors and AI chips clean and efficient with our high-quality alcohol wipes, designed for safe and effective residue removal.
JP-CL1
$12.00 each
  • Key Features

    1. Efficient Thermal Paste Removal

    • Specially formulated to clean thermal paste and other residues that can affect your CPU’s cooling performance.

    • Ensures a clean surface for reapplying thermal compounds.

    2. Improves Heat Dissipation

    • Enhances the thermal conductivity between your CPU, GPU, and heatsink by removing dirt and grime.

    • Prevents thermal impedance for better cooling efficiency.

    3. Convenient and Easy to Use

    • Pre-moistened wipes provide a quick and hassle-free cleaning experience.

    • Perfect for both professionals and DIY enthusiasts.

    4. Safe and Eco-Friendly

    • Non-toxic formula is safe for you and your components.

    • Environmentally friendly with minimal volatile content.


    Applications

    Thermal Paste Cleaning:

     Ideal for cleaning thermal interface materials on CPUs, GPUs, and heatsinks.

    Maintenance for Longevity:

     Keeps your components clean, ensuring optimal performance and extended lifespan.

    Reapplication of Thermal Compounds:

     Prepares surfaces for precise and effective reapplication of thermal paste.

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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