JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

2g
2g2g2g
product category, Nano-Diamond Thermal paste

NANO DIAMOND THERMAL GREASE DXSQUARE ELITE

Improve semiconductor and AI chip efficiency with our advanced cooling solutions, featuring high-quality thermal compounds and reliable heat management systems.
Product Capacity
$20.00 each

  • DXSquare Elite Nano Diamond Thermal Paste is designed to meet the advanced thermal management

    needs of high-performance electronic devices. By leveraging JunPus next-generation breakthrough

    technology with square nano diamond particles, this thermal paste provides exceptional cooling solutions,

    significantly reducing the operating temperatures of electronic components. Compared to traditional

    spherical nano diamond particles, square nano diamond particles offer superior thermal conductivity and

    heat dissipation due to their larger contact area and better packing efficiency, improving gap filling

    efficiency by approximately 25%.

JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

Our Company
Customer Services
Contact Info

Do you need assistance?

For any questions or concerns, you can reach us via our contact form

Login

Your Cart

The cart is empty