Enhancing Thermal Management for High-Powered Devices

With the rapid evolution of technology, the demand for efficient thermal management in high-performance electronic devices is at an all-time high. In response, JunPus International proudly introduces the JP-DX2 Nano-Diamond Thermal Compound—a cutting-edge thermal interface material (TIM) designed to meet the challenges of modern electronics.

Key Features and Technical Specifications

1. Exceptional Thermal Conductivity

JP-DX2 offers an industry-leading thermal conductivity of 17 W/m·K, ensuring efficient heat transfer and maintaining critical component stability under heavy workloads.

2. Low Thermal Resistance

Featuring a thermal resistance value of just 0.048℃·cm²/W, JP-DX2 minimizes heat dissipation barriers, enabling superior thermal management in compact and high-density electronic environments.

3. Wide Temperature Stability Range

Designed to operate effectively across a range of -150℃ to 350℃, JP-DX2 is ideal for extreme temperature conditions, ensuring reliable performance in both consumer electronics and industrial applications.

4. Advanced Nano-Diamond Formulation

Utilizing nano-diamond particles, JP-DX2 achieves superior gap-filling properties, reducing voids in thermal interfaces and optimizing heat transfer efficiency.

5. Environmentally Safe and Long-Lasting

• Low Volatile Content: With a volatility of just 0.18% at 120℃ over 96 hours, JP-DX2 is engineered for long-term stability.

• Minimal Outgassing: At high temperatures (200℃ for 96 hours), JP-DX2 exhibits a negligible outgassing rate of 0.01%, making it suitable for sensitive electronic environments.

6. Ease of Application

The compound’s viscosity of 5,000,000 mPa·s allows for smooth application while maintaining stability over time. JP-DX2 is electrically non-conductive, ensuring safety and compatibility with a wide range of components.

Applications in AI and High-Performance Computing

JP-DX2 is specifically engineered for AI-driven workloads, supercomputing environments, and high-powered GPUs and CPUs. With its high thermal conductivity and exceptional stability, it ensures sustained performance during data-heavy operations like:

• AI Model Training and Inference: AI processors such as GPUs and TPUs require efficient cooling during prolonged computation. JP-DX2 minimizes thermal throttling, allowing for faster and more stable operations.

• Supercomputing Tasks: High-performance clusters running scientific simulations or big data analysis benefit from JP-DX2’s ability to handle intensive workloads without overheating.

• Gaming and Professional Workstations: JP-DX2 is an excellent choice for gamers and creators who demand peak CPU and GPU performance, reducing heat buildup and maximizing hardware lifespan.

Why Choose JP-DX2?

• Cutting-Edge Technology: Leveraging nano-diamond particles, JP-DX2 delivers unmatched thermal performance.

• Versatility: Suitable for consumer electronics, industrial systems, and enterprise-grade servers.

• Eco-Friendly Design: Low environmental impact, adhering to the highest industry standards.

About JunPus International

JunPus International is a global leader in thermal management solutions, committed to innovation and excellence. With cutting-edge research and development, JunPus continues to redefine industry standards in thermal interface materials.

For inquiries or further information, please visit www.junpus.com or contact our sales team.