JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

JP-DXSquare Elite Thermal Paste Aligns with CES 2025 Trends in AI, EV, and Server Heat Management

Taipei , Taiwan – January 8, 2025 —— As CES 2025 sets the stage for global tech innovations, JunPus reinforces its leadership in thermal management solutions with its flagship product, JP-DXSquare Elite Thermal Paste. Designed to address the increasing heat dissipation demands of AI processors, EV battery systems, high-performance GPUs, and servers, this advanced thermal paste is poised to be a game-changer for industries that require efficient and long-term thermal stability.

Revolutionizing Thermal Solutions with JP-DXSquare Elite

 

With the rapid evolution of high-performance electronic devices, effective heat management has become critical to ensure system stability, efficiency, and longevity. The JP-DXSquare Elite Thermal Paste from JunPus delivers exceptional thermal conductivity, low thermal resistance, and outstanding durability, making it a perfect fit for next-generation applications.

 

Key Features of JP-DXSquare Elite Thermal Paste:

Superior Thermal Conductivity (18.3W/mK) – Ensures efficient heat transfer to keep components cool during peak performance.

Long-Term Stability and Aging Resistance – Ideal for long-duration operations, preventing performance degradation.

Low Thermal Resistance – Provides fast and effective heat dissipation between contact surfaces, reducing overheating risks.

Easy Application and Reusability – Designed for industrial manufacturing processes and maintenance, enhancing usability.


Meeting Market Demands: AI, Electric Vehicles, and IoT Applications

 

At CES 2025, emerging trends such as AI computing, electric vehicles (EVs), and IoT devices took center stage, all requiring cutting-edge thermal solutions. JunPus continues to focus on high-efficiency, environmentally friendly thermal materials to address these growing needs.

 

The CEO of JunPus stated:

“Our flagship product, JP-DXSquare Elite, represents a key step forward in thermal technology. We are confident that our innovations will meet the rising thermal demands of high-power electronics in the global market.”


JunPus 2025 Strategy: Expanding Global Reach with Customized Thermal Solutions

Looking ahead to 2025, JunPus is committed to increasing its participation in global exhibitions and technical forums, promoting its JP-DXSquare Elite Thermal Paste to partners and customers worldwide. The company is focusing on expanding its presence in North America, Europe, and Asia, offering customized thermal solutions for various industries, including consumer electronics, EVs, and industrial applications.


About JunPus

JunPus is a leading thermal materials provider based in Taiwan, specializing in thermal pastes, thermal pads, and phase change materials. Our products are widely used in AI computing, electric vehicles, servers, and medical equipment, providing reliable, high-performance thermal management solutions to customers worldwide.

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JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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