JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JUNPUS / LIQUIDTHERM
Liquid cooling starts with
the whole system.
From the chip interface to the facility loop, every connection matters. Explore the architecture, then define your coolant requirements with JunPus.
Confirm LiquidTherm suitability for your equipment and operating conditions with JunPus.
A MODERN LIQUID-COOLING ARCHITECTURE
A single-phase, liquid-to-liquid example. The coolant remains inside each circuit; only heat passes across the CDU’s heat exchanger.
Two separate circuits exchange heat at the CDU. The technology loop carries heat from the cold plates; the facility loop carries it onward to heat rejection.
Conceptual architecture. Pump, filtration, sensing and redundancy arrangements vary by system. Colors indicate relative supply and return roles. Other components may need air cooling.
The fluid flows through internal channels next to the heat source, with supply and return connections kept distinct.
Its heat exchanger and secondary pumping system connect heat removal at the rack to facility cooling.
The cooling plant and its pumps complete the primary circuit. The heat-rejection method depends on the site.
FROM THE CHIP INTO THE FLOW
The interface material transfers heat across the contact between the package and cold plate.
The plate conducts heat into its internal flow passages. Coolant stays inside the sealed fluid path.
The fluid transports heat to the CDU. Thermal properties, flow resistance and compatibility must be evaluated together.
This is direct-to-chip cooling context. It does not establish suitability for immersion or direct contact with powered electronics.
JUNPUS COOLANT
Start with LiquidTherm’s listed product information, then review the fluid requirements of your equipment with JunPus.
Preparation
No additional water required
Listed pack
Transparent liquid
Listed component
Propylene glycol
Sealed shelf life
Properly sealed; not operating life
JunPus also describes anti-corrosion and antibacterial additives. Request the current approved technical and safety documents, compatible materials and relevant test conditions.
Confirm the applicable formulation, system compatibility and operating limits with JunPus before use.
WHY START WITH JUNPUS?
The listed formula avoids a separate water-dilution step when used as directed. Confirm the specified fluid against your equipment requirements.
JunPus presents coolant alongside compounds, pads and tapes, allowing interface and fluid questions to be discussed while keeping their roles distinct.
JunPus’s consultation service accepts liquid-cooling requirements, application conditions and documentation questions. Scope and availability are confirmed individually.
DEFINE THE NEXT STEP
Tell JunPus what you are building and what the coolant needs to achieve. Discuss the current product, the evidence your application needs and whether a specific development or supply request can be supported.
Equipment model, heat load
and cooling architecture
Fluid temperatures,
flow and pressure limits
Metals, seals, tubing
and the existing fluid
Test criteria, documents,
quantity and timing
Product suitability, any requested customization and supply terms require confirmation. Agree a suitable exchange method before sharing confidential designs.
JunPus LiquidTherm Coolant is a ready-to-use liquid for water-cooling systems. The listed 1,000 ml transparent formula contains propylene glycol below 6%, with a shelf life of at least three years when properly sealed.
Confirm the applicable formulation, system compatibility and operating limits with JunPus before use.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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