JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
Small particles may occupy spaces between larger particles.
Particle shape and packing vary by formulation.
Thermal impedance · °C·cm²/W
45 psi is approximate. Dashed segments connect reference points; they are not a raw measurement curve.
Exposure time: 0–1000 hours. Each series uses a fixed measurement pressure.
● 20 psi · ● 40 psi · ● 60 psi
Thermal impedance · °C·cm²/W
Measurement conditions: 20, 40 and 60 psi; 100 W; 60 minutes per measurement; 23 ± 3°C and 55 ± 3% RH; 10 specimens. Reference data, not a specification for the current formulation.
CPU → DX1 interface → heatsink. Control the mounting, sensors, load and environment before evaluating the result.
Validate suitability in your actual hardware and operating conditions.
The X pattern illustrates the application concept. Confirm the amount and method with your processor and cooler instructions.
Nano-Diamond Formula
Electrically Non-Conductive
Non-Curing Grease
Apply JP-DX1 in an X-shaped pattern on the prepared contact surface.
Install the cooler evenly to help spread the paste across the interface.
The 60 psi specification is a laboratory reference condition, not an instruction to apply that pressure to a processor.
HWBOT · der8auer · March 24, 2013
Thermal Paste Roundup: First Round ↗SFFReview · John Morrison · May 19, 2013
Test duration, storage life and installed service life are different.
To assess pump-out or material movement, define the assembly, bond line, pressure, thermal cycles and inspection method. No permanent-performance, no-loss or fixed-year guarantee is established here.
JP-Dx1 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity. Formulated with nanodiamond powder and silicone fluids, JP-Dx1 delivers exceptional heat dissipation for applications requiring advanced thermal management.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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