JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
MATERIAL & APPLICATION
JP-DX2 combines nano-diamond powder with silicone-based material for use at the thermal interface.
Nano-diamond powder and silicone-based material.
A thermal grease option for electronic assemblies.
Apply to the contact area using your hardware’s recommended method.
THE CONTACT LAYER
JP-DX2 forms the contact layer between the processor surface and cooler base.
How readily a material carries heat.
The final paste-layer thickness between the assembled contact surfaces.
The interface’s opposition to heat flow. Conductivity, bond-line thickness and contact quality all affect it.
CONSISTENCY & GPU APPLICATION
Viscosity describes a material’s resistance to flow. JP-DX2 forms a thin thermal-paste layer between the GPU contact surface and a compatible heatsink base.
GPU die → JP-DX2 contact layer → heatsink.
The fan draws air upward through the fins in this layout.
Retain the board maker’s specified thermal pads. Do not replace pad-filled gaps with a thick layer of paste.
Match the application to the GPU board and cooler design.
Illustrative curve
TEMPERATURE RANGE
Material temperature-stability ranges for JP-DX2 and JP-DX1.
HIGH-TEMPERATURE AGING
JP-DX2 high-temperature baking
High-temperature baking exposure: 125 °C for 1,000 hours. Measurement pressures: 15, 30 and 45 psi.
JP-DX2 TECHNICAL DATA
Open full specification card →
| Property | JP-DX2 | Condition |
|---|---|---|
| Model | JP-DX2 | Nano-diamond thermal grease |
| Main materials | Nano-diamond powder and silicone-based material | |
| Appearance | Gray | |
| Thermal conductivity | 17 W/m·K MAX | Maximum specification |
| Density | 2.9 g/cm³ | |
| Electrical conductivity | Non-conductive | |
| Dielectric constant | 14.5 | 1 MHz |
| Temperature stability | −150 to 350 °C | Material stability range |
| Volatile matter | 0.18% | 120 °C · 96 hours |
| Outgassing | 0.01% | 200 °C · 96 hours |
| Initial thermal impedance (15 psi) | 0.0911 °C·cm²/W | 0 h baking-test baseline · LW-9389 |
| Initial thermal impedance (30 psi) | 0.0804 °C·cm²/W | 0 h baking-test baseline · LW-9389 |
| Initial thermal impedance (45 psi) | 0.0784 °C·cm²/W | 0 h baking-test baseline · LW-9389 |
For operating conditions, storage guidance and shelf life, contact JunPus with your hardware requirements and pack format.
Exposure: 125 °C · 1,000 hours.
Measurement pressures: 15 / 30 / 45 psi.
Measured property: thermal impedance.
JP-DX2 is a cutting-edge thermally conductive compound designed to meet the rigorous demands of modern AI chips, semiconductors, and high-performance electronics. Made from high-purity thermal conducting materials, its nanoscale-treated molecular structure ensures superior thermal conductivity. Formulated with nanodiamond powder and silicone fluids, JP-DX2 delivers exceptional heat dissipation for applications requiring advanced thermal management.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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