JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
THERMAL INTERFACE MATERIAL EXPORTER, FACTORY IN TAIWAN
JunPus International Co., Ltd. is a global leader in heat dissipation solutions, specializing in high-performance thermal materials such as thermal paste, thermal pads, and thermal interface materials for AI chips, CPUs, GPUs, and 5G base stations. Our patented technologies optimize thermal performance, ensuring stability for semiconductors, neural network accelerators, and edge computing devices under high workloads. Trusted by industries in electronics, telecommunications, and automotive sectors, JunPus drives innovation in thermal management for AI systems, data centers, and smart devices, delivering outstanding solutions based on heat dissipation expertise.
Excellence in Heat Dissipation Engineering
For electronics and server assemblies: discuss material compatibility, deposit geometry and your dispensing process before sample evaluation.
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Bring the CPU, GPU and cooling assembly together. Explore the DX series and prepare a clean, consistent thermal interface.
Explore the DX series →From automated dispensing to your next PC build, start with the right thermal interface.
Start with your application. Explore products and compare their published specifications before choosing a material.
CPU & GPU cooling. From gaming to servers. Square nano-diamond thermal grease at the contact joint between a processor and a heatsink or cold plate. Intended applications include gaming PCs, workstations and servers.For high-power chip, FPGA and ASIC projects, JunPus can review the package, heatsink or cold plate, and operating conditions to assess material suitability.
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At the processor-to-heatsink interface. Nano-diamond thermal grease for the thin contact layer between a GPU contact surface and a compatible heatsink base. Keep the board maker’s specified pads on surrounding components.For high-power chip, FPGA and ASIC projects, material selection requires a review of the package, mounting load and thermal-paste layer thickness.
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CPU & GPU interfaces. Controlled placement. Nano-diamond thermal paste for the joint between a processor and its cooling assembly where thermal grease is specified. Follow the hardware maker’s application and mounting instructions.For high-power chip, FPGA and ASIC projects, evaluate the contact area, cooling assembly and application process before selecting the thermal interface material.
View product & specifications →High-power chip, FPGA and ASIC references are evaluation requests, not model-specific compatibility or performance claims. Confirm suitability using current technical documentation and testing in the actual assembly.
Review the joint geometry, mounting load and electrical requirements before choosing a thermal interface material.
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Understand the external module-to-cooler interface, electrical isolation and validation needs for inverter and UPS assemblies.
Read the article →Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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