JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
September 12–18, 2026
As AI servers continue to move toward higher chip power, advanced packaging and direct-to-chip liquid cooling, thermal performance can no longer be evaluated by thermal conductivity alone.
This week, JunPus reviewed new technical and industry materials covering three important areas:
1. PFAS transparency and cooling-material supply chains
2. Cold-plate and coolant co-design for high heat flux
3. Transient thermal loads and reliability validation
The external data summarized below does not represent JunPus product performance or customer qualification results. It is provided as an engineering reference for application-specific evaluation.
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Server Cooling Solutions
High-Performance Thermal Materials
Thermal Paste Expert
Thermal Interface Material
High Thermal Conductivity
Cooling Solutions
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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