JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JUNPUS / NANO-DIAMOND THERMAL GREASE
JP-DXSquare Elite
A refined interface for CPU and GPU cooling.
JP-DXSquare Elite is a square nano-diamond thermal grease for the contact layer between a CPU or GPU and its cooler.
Discover JP-DXSquare Elite
The paste conforms to surface irregularities to help reduce interfacial air gaps. Fine square filler outlines are shown schematically within the paste. Surface roughness, particle size, spacing and layer thickness are exaggerated for explanation; this is not microscopy or a measured void-fraction result.
PRODUCT OVERVIEW
Elite forms the thermal interface between a heat-generating component and its cooler. The compound fills surface irregularities at the contact joint, supporting heat transfer into a heatsink or cold plate.
Its gray, square nano-diamond formulation combines filler design with surface-modification technology and metal-surface wettability.
JunPus identifies high-performance CPU and GPU cooling, gaming PCs, workstations, servers and high-performance computing systems among its intended applications.
THE ELITE FORMULATION
Elite’s square nano-diamond formulation brings together surface-modified filler and a carrier system formulated without small-molecule solvents. These material characteristics guide application and process evaluation.
The technical data describes morphology refinement and micro-alloy doping as the filler-surface modification methods.
The formulation is designed to wet metal contact surfaces, helping establish the interface between a component and its cooler.
Screen printing is a documented application option. Evaluate coverage and process settings for the intended contact area.
CPU / GPU / LIQUID COOLING
The thermal compound works at the solid contact joint between the processor and cooler. Evaluate Elite for your heat source, cooler design and assembly process.
Evaluate Elite for the grease interface between a CPU’s integrated heat spreader and the contacting base of a heatsink or cold plate. Gaming PCs, workstations and server systems are among its intended applications.
High-performance GPUs are also an intended application. The illustration shows paste at a bare GPU die-to-cold-plate interface. Follow the board maker’s requirements for the actual package and retain specified thermal pads on surrounding components.
In a liquid-cooled assembly, the thermal paste transfers heat across the processor-to-cold-plate interface. The cooling loop carries that heat onward from the cold plate.
Application examples describe intended use. Confirm suitability for the exact hardware and assembly process.
SELECTION & APPLICATION
Select the compound based on the component, cooler and application process, then evaluate it under representative operating conditions.
Identify the component surface, cooler material, contact area and hardware mounting requirements.
Establish the application method, paste quantity, coverage and assembled bond line.
Consider the expected workload, thermal cycling and service requirements when planning evaluation.
Check the current specification, required pack format and storage instructions with JunPus.
A reference for evaluating application equipment and process settings. Screen-printing parameters and paste coverage should be established for your assembly.
Follow the hardware manufacturer’s cleaning and mounting instructions. Verify paste coverage and cooler contact, then check thermal behavior under a representative workload.
Published storage condition: 20 ± 5°C. Follow the supplied product label and current handling instructions. Laboratory test pressures are not processor-mounting instructions.
For formulation or viscosity requirements, share the target range, measurement temperature and method with JunPus. Ask which existing products and technical data are available for evaluation.
THE JUNPUS FAMILY
Compare manufacturer-listed material properties and application guidance, then validate the selected compound in your assembly.
Scroll to compare all three models.
| Listed property | JP-DX1 | JP-DX2 | JP-DXSquare Elite |
|---|---|---|---|
| Appearance | Gray | Gray | Gray |
| Density | 2.7 g/cm³ | 2.9 g/cm³ | 2.58 g/cm³ |
| Formulation description | Nano-diamond and silicone-based compound | Nano-diamond and silicone-based compound | Square nano-diamond formulation |
| Application information | Printing and coating described in the family catalog | Screen printing and dispensing described in the reliability report | Metal-surface wettability and screen-printing suitability described in technical data |
A nano-diamond and silicone-based compound. Start here when reviewing the family catalog’s printing and coating applications, then confirm the product and process requirements with JunPus.
Explore JP-DX1A nano-diamond and silicone-based compound with screen-printing and dispensing applications described in its technical documentation. Consider it when evaluating those application processes.
Explore JP-DX2A square nano-diamond formulation with documented metal-surface wettability and screen-printing suitability. Evaluate it for CPU and GPU interfaces that need close attention to surface contact and assembly conditions.
Review Elite selection guidanceThese starting points are not exclusive uses or performance tiers. Confirm the current specification, application process and assembly results before selection.
These are manufacturer-listed properties, not a controlled head-to-head benchmark. A thermal-performance comparison requires matched pressure, temperature, bond line and test method. Density alone does not rank cooling performance.
IDEALIZED 2D MODEL / NOT PRODUCT TEST DATA
Equal-width round and square profiles leave different gaps on the same square grid. This simple model explains a geometric idea. It does not measure the packing or cooling performance of any JunPus formulation.
21.5% of the cell area remains uncovered.
No uncovered area in this ideal tiling.
This is a difference in calculated two-dimensional area coverage, not an improvement in thermal conductivity, CPU temperature or actual filler packing. Real powders contain three-dimensional particles, a binder and a size distribution.
Both panels use 16 profiles on a square grid with pitch d. Each circle has diameter d; each square has side length d. Circle coverage is π ÷ 4 ≈ 78.5%. Square coverage is 100%. The difference is 100 × (1 − π ÷ 4) ≈ 21.5 percentage points.
The shapes have different material areas, so this is not an equal-filler-content comparison. No binder thickness, particle-size distribution, surface roughness, pressure or three-dimensional packing is modeled. The round arrangement is not optimized. These calculations do not verify the brochure’s approximately 25% gap-filling claim.
JP-DXSquare Elite
| Property | Document-listed value |
|---|---|
| Appearance | Gray |
| Density | 2.58 g/cm³ |
| Viscosity | 3,900,000 mPa·s22°C |
| Volume resistivity | 1.95 × 1012 Ω·cm |
| Volatile content | 0.07%150°C · 3 hours |
| Storage temperature | 20 ± 5°C |
Confirm the current specification and application-specific requirements with JunPus.
READ THE TEST CONDITIONS
The three company reliability reports describe these exposure programs and LW-9389 measurements at 15, 30 and 45 psi. They remain separate studies, rather than a matched three-product benchmark.
At least 1,000 hours
At least 250 cycles
At least 1,000 hours
Matching exposure labels do not establish identical batches, bond lines, measurement temperatures or uncertainty. No relative-performance score is assigned.
ELITE / REPORTED OUTCOMES
Elite’s reliability report records the following thermal-impedance outcomes at measurement pressures of 15, 30 and 45 psi.
reported increase
reported increase
reported variation
Report summary limits under stated conditions. They are not a service-life guarantee, a universal assembly result or a ranking against the other formulations.
DOCUMENTED SYSTEM REFERENCE
The Elite technical data includes a water-cooled Intel Core i7-13700K system tested with AIDA64 Extreme FPU stress, a nominal 254 W load and the cooling fan speed fixed at 60%.
This identifies one documented test setup. It does not establish universal CPU, GPU or cooler compatibility.
ENGINEER THE INTERFACE
Contact JunPus to discuss product selection and supporting technical data for your application.
Ask about JP-DXSquare EliteJP-DXSquare Elite is a square nano-diamond thermal grease for the contact layer between a CPU or GPU and its cooler.
Its gray formulation combines filler design with surface-modification technology and metal-surface wettability. Evaluate the compound for the intended hardware and assembly process.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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