JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JunPus Thermal Solutions
Bring thermal contact and adhesive attachment into one considered interface. Plan the bond, liner handling and cut geometry around your assembly.
Compare the materialsHeat transfer + bonding
The two surfaces
Select the tape grade and process for your assembly. Application validation is required.
The tape remains between the two mating surfaces. The release liner protects the adhesive during handling and is removed before that side is bonded. It is not a cooling layer.
Different products create different bonding problems. The following concepts show the exact contact location for each application family, with qualification needs kept visible.
Lighting & illumination
Bond the flat backside of an LED metal-core board to its designed aluminium heat-spreading surface. Keep the adhesive away from LEDs, optics and electrical contacts.
Where to evaluate itLight bars, linear lighting and selected luminaire board-to-housing interfaces. Match the tape footprint to the thermal contact area, not the illuminated face.
What must be checkedBoard flatness, surface finish, electrical clearances, bond area, thermal cycling and the luminaire’s retention requirements.
Compact electronics & network hardware
Evaluate a lightweight heat sink attached to a suitable flat package lid or a designed heat-spreading surface. The tape sits beneath the sink base, not across nearby components.
Where to evaluate itCompact controllers, networking hardware and edge electronics where a small heat sink needs a defined bonded interface. Not a blanket recommendation for every processor.
What must be checkedPackage surface and allowable load, heat-sink mass, shear/peel forces, vibration, rework needs and actual junction temperature under load.
Power electronics & electrification
A conditional engineering concept for bonding a flat module baseplate to a cooling plate. Treat thermal, electrical and mechanical qualification as a combined design task.
Where to evaluate itPower-electronics assemblies used in industrial drives, charging and energy systems.
What must be checkedElectrical isolation, sustained temperature, coolant-system design, bond durability, service loads, retention and safety requirements. Do not replace specified fasteners or battery protection layers.
Battery module thermal management
Evaluate the external, designed thermal contact face of a battery module against its cooling plate. This is a system-level engineering question, not a universal direct-cell adhesive recommendation.
Where to evaluate itModule-to-cooling-plate mounting for engineering discussion in electrification and energy-storage projects.
What must be checkedElectrical isolation, cell/module movement, thermal cycling, moisture, ageing, shear and peel loads, mechanical retention and battery-system safety. Tape is not a substitute for required fire barriers or cell insulation.
The selected grade must be evaluated in the actual assembly.
Precision converting & placement
Specify the footprint before removing the liner. The dimensions belong to your assembly drawing, including any cut-outs and electrical or mechanical clearances.
Confirm length, width, thickness, corner shape and cut-outs. Keep the specified bond area within the intended contact surfaces.
Keep the supplied protective liners in place during cutting where practical. Use a clean, controlled method without stretching or creasing the tape.
Check the cut against the approved drawing. Avoid frayed edges, contamination, burrs, trapped liner and encroachment on contacts or fasteners.
A clear reference sequence for a two-liner double-sided format. Follow the actual product label, technical data sheet and equipment instructions when the supplied format differs.
Power down and disconnect the equipment. Use the required ESD controls. Confirm the correct tape grade, surface compatibility and assembly method. Do not assume tape is electrically insulating or mechanically sufficient without the relevant data.
Remove contamination and old material using the surface and equipment maker’s approved method. Let both faces dry completely. Do not touch the cleaned bond areas.
Confirm Length (L), Width (W) and the required profile against the assembly drawing. Cut on a suitable separate work surface with the liners retained where practical. Keep the tape flat and unstretched; protect cut-outs and clearances for leads, connectors and fasteners.
Remove the first release liner. Align the exposed adhesive to one prepared surface and apply it progressively, avoiding folds and trapped air. Keep the outer liner in place for handling.
Pinch only the liner tab. Peel it back progressively, following the grade-specific handling direction, while keeping the adhesive layer flat on the first surface. Do not pull the tape upward or touch the exposed bond area.
Bring the second surface into alignment before contact. Seat it evenly and apply the pressure, time and temperature specified for the selected grade and assembly.
Check alignment, full intended contact and any specified retention. Validate adhesion, thermal performance and durability in representative operating conditions before release.
This checklist supports preparation. It does not approve a material or replace engineering validation.
Share your actual interface with JunPus. A thermal-conductivity value alone does not establish suitability for a bonded assembly.
High-Performance Thermal Tape
Thermally conductive adhesive tape
Confirm with JunPus for the intended application
Confirm thickness, width, length and converting options
Request grade-specific values and test conditions
Request grade- and thickness-specific insulation / voltage data with test conditions
Request handling guidance and applicable documents
Tell us the two surface materials, contact footprint, gap or flatness limits, thermal load, operating environment, retention needs and planned quantities. Include any required electrical isolation, rework or qualification criteria.
Start with your assembly, contact area and operating requirements. JunPus can discuss material options and the information needed for your evaluation.
Pad · Paste · Tape · Gel / Application guide
A graphics card, CPU cooler, LED light bar and compact circuit board need different interfaces. First check the gap, attachment method and assembly process.
Heat source→Selected interface material→Heat sink or spreader→System cooling
Fill a specified gap with a pre-cut piece.
Graphics-card VRAM / VRM, SSDs and other assemblies with a designed component-to-cooler gap.
Component top → pad → cooler contact surface. The pad conforms under the specified compression.
Match thickness, hardness and compression to the actual gap. Too much force can stress parts; insufficient contact leaves an ineffective heat path.
Retain the designed mounting hardware. Surface tack does not make a pad an adhesive fastening tape.
Thin contact under a retained cooler.
Desktop CPUs, workstations and server processors where the cooler design specifies thermal compound.
Between the CPU lid or approved package surface and the cooler base. It fills small surface irregularities.
The surfaces already mate closely. Screws or clamps provide the mounting force; the paste improves thermal contact.
Check the specified compound, contact pressure, layer thickness and ageing behaviour. Do not use paste as a fastener or bulk gap filler.
Thermal contact with adhesive attachment.
LED light bars, metal-core LED boards and compact heat spreaders designed for adhesive mounting.
Between the flat board backside and its aluminium support, or between a component and its designed heat spreader. Remove the release liner.
The assembly needs both a heat path and a controlled adhesive footprint. Die-cut tape can match the required bonding area.
Validate holding force, peel, temperature, ageing and electrical requirements on the actual assembly. Retain specified screws or clips.
Patterned thermal contact with low assembly stress.
Smartphone AP, PMIC and memory interfaces, compact PCB assemblies and sensor modules with pressure-sensitive components.
On defined chip or component contact areas, connecting them to a metal frame, heat spreader or housing.
Dispensing or screen printing can place material only where it is needed. The soft-gel concept targets controlled contact with low mechanical stress.
For JP-TG40S, confirm final layer thickness, dispense pattern, curing, reliability and released documentation. It is not presented as an adhesive fastener.
JP-TG40S · Preliminary engineering concept
JP-TG40S status & selection limitsCompare all four ↑Choose the interface, not just the product label. One device may use different thermal materials in different locations. Do not substitute Tape, Gel or Pad for a CPU/GPU’s specified primary interface without engineering validation.
Use the material guide above to compare the contact design, then open the relevant product information.
Back to all four materials ↑Bring thermal contact and adhesive attachment into one considered interface. Plan the bond, liner handling and cut geometry around your assembly.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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