JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JunPus LiquidTherm Coolant is a ready-to-use liquid for water-cooling systems. The listed 1,000 ml transparent formula contains propylene glycol below 6%, with a shelf life of at least three years when properly sealed.
Confirm the applicable formulation, system compatibility and operating limits with JunPus before use.
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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